SK Hynix to break ground on new U.S. chip packaging plant early next year -sources

By Alexandra Alper

WASHINGTON -South Korea’s SK Hynix goals to pick out a U.S. website for its superior chip packaging plant and break floor there across the first quarter of subsequent 12 months, two individuals conversant in the matter stated, serving to the USA to compete as China pours cash into the burgeoning sector.

The plant, whose estimated value could be “a number of billions,” would ramp as much as mass manufacturing by 2025-2026 and make use of about 1,000 staff, one of many sources stated, declining to be named as a result of particulars concerning the plant haven't been made public.

It could possible be positioned close to a college with engineering expertise, the particular person stated.

The corporate is “hoping to select of the positioning and break floor someplace across the first quarter of subsequent 12 months,” one of many individuals stated.

SK Group, South Korea’s second-biggest conglomerate, owns reminiscence chipmaker SK Hynix and introduced the brand new plant final month as a part of a $22 billion U.S.-based funding package deal in semiconductors, inexperienced vitality and bioscience tasks.

The announcement, heralded by the White Home, stated $15 billion could be allotted to the semiconductor business by means of analysis and improvement applications, supplies, and the creation of a complicated packaging and testing facility.

“R&D investments will embody constructing out a nationwide community of R&D partnerships and amenities,” the supply stated, including that the packaging facility would package deal SK Hynix’s reminiscence chips with logic chips designed by different U.S. firms for machine studying and synthetic intelligence purposes.

The corporate, following the Reuters story concerning the timing of the groundbreaking, confirmed it plans to pick out a website for the plant within the first half of subsequent 12 months however stated no choice has been made on when to start building.

The USA way back ceded most simple, low worth chip packaging operations to abroad factories largely in Asia, the place chips are positioned into protecting frames that are then examined earlier than being shipped to electronics producers.

However contemporary battle strains are being drawn within the race to develop superior packaging methods, which contain inserting totally different chips with totally different capabilities right into a single package deal, enhancing total capabilities and limiting the added value of extra superior chips.

“Whereas the USA and its companions have superior packaging capabilities, China’s huge investments in superior packaging threaten to upend the market sooner or later,” the White Home stated in a 2021 report.

An government at China’s prime chipmaker SMIC, which was added to a U.S. commerce blacklist in 2020, stated final 12 months Chinese language firms ought to give attention to superior packaging to beat their weaknesses in growing extra refined chips, in line with the report.

SK Group’s transfer comes after Biden signed into regulation the CHIPS Act this week, offering $52 billion in subsidies for chip manufacturing and analysis, in addition to an estimated $24 billion funding tax credit score for chip crops. The sources stated the R&D amenities and the chip packaging plant would each qualify for the funding.

There was a flurry of enlargement plans introduced by chipmakers in the USA in recent times, from Taiwan Semiconductor Manufacturing Co to Samsung Electronics and Intel.

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